On using rectangle packaging for SOC wrapper/TAM co-optimization

Journal

Proc. VLSI Test Symposium, May 2002  

Proc. VLSI Test Symposium, May 2002, 253-258, 2002 

Cited by:  2

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Codes

  • NII Article ID (NAID) :
    10012107931
  • Article Type :
    Proceedings
  • Databases :
    CJPref