Oxidation Mechanism of Copper at 623-1073K

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In reviewing the results reported for copper oxidation at intermediate temperatures from 573 to 1173 K, the oxidation mechanism at the lower part of this temperature range and the reason for the change in activation energy with decreasing the temperature remain unclear. To make it clear, copper oxidation is studied at 623–1073 K under 0.1 MPa O<SUB>2</SUB> using a commercial 99.9999% pure copper. The oxidation kinetics is essentially parabolic, and the activation energy decreases from 111 kJ/mol at 873–1073 K to 40 kJ/mol at 623–773 K . The growth of Cu<SUB>2</SUB>O is predominant and it obeys the parabolic law at 623–773 K, as well as the case at 873–1073 K . In addition to grain boundary diffusion of copper along the fine and thin columnar Cu<SUB>2</SUB>O grains, the non-protective CuO whisker layer, which cannot keep the oxygen potential constant at the Cu<SUB>2</SUB>O/CuO interface, should be responsible for the decrease in the activation energy at 623–773 K.

収録刊行物

  • Materials transactions

    Materials transactions 43(9), 2173-2176, 2002-09-01

    公益社団法人 日本金属学会

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各種コード

  • NII論文ID(NAID)
    10012325868
  • NII書誌ID(NCID)
    AA1151294X
  • 本文言語コード
    ENG
  • 資料種別
    ART
  • ISSN
    13459678
  • NDL 記事登録ID
    6312533
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z53-J286
  • データ提供元
    CJP書誌  CJP引用  NDL  J-STAGE 
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