Copper Powder for Termination Electrode in MLCC

この論文にアクセスする

この論文をさがす

著者

抄録

Conventional copper powder used to form terminations of MLCC generally contains large flakes with high aspect ratios and large agglomerate spherical particles. The use of agglomerate powder and large flakes results in low dry film density, and thus a thicker film. In our research, we focused on highly dispersed, uniform, and fine flakes and powder that did not contain coarse particles, and examined the paste characteristics and their effect on firing conditions. We found that a smaller particle size would increase the thixotropic value and result in an earlier start to firing. We also discovered that the agglomerate condition of powder had a significant influence on the rheology of the paste. A higher degree of agglomeration would result in higher viscosity and a higher thixotropic value, but would not have a major effect on the firing condition.

収録刊行物

  • 粉体および粉末冶金

    粉体および粉末冶金 50(11), 908-911, 2003-11-15

    Japan Society of Powder and Powder Metallurgy

参考文献:  1件中 1-1件 を表示

  • <no title>

    SAKAUE T.

    Proceedings CARTS, 2001, 2001

    被引用文献1件

各種コード

  • NII論文ID(NAID)
    10012549438
  • NII書誌ID(NCID)
    AN00222724
  • 本文言語コード
    ENG
  • 資料種別
    ART
  • ISSN
    05328799
  • NDL 記事登録ID
    6787064
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z17-274
  • データ提供元
    CJP書誌  NDL  J-STAGE 
ページトップへ