A New Plasma Process for Surface Treatment prior to Wire Bonding that Utilizes the Sublimation Effect of Alkyl Group Radicals

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Conventionally, argon plasma has been used as a method of improving wire bonding performance by removing contaminants (nickel, nickel oxides, and impurities concentrated on the gold surface) from the gold bond pads after the die-bond cure process. The sputtering effect of argon plasma is the primary mechanism by which contamination is removed, and as a result this technique has some problems such as excessive thinning of the gold bond pads. In order to avoid these negative side effects, we developed a new plasma process for surface treatment prior to wire bonding. This new plasma process uses a methane (CH4)/hydrogen (H2)/Ar mixture, which selectively removes the contaminants from the gold bond pads, primarily through the sublimation effect of alkyl group radicals generated from CH4. This new process improves wire bonding performance by removing contaminants efficiently.

収録刊行物

  • Japanese journal of applied physics. Pt. 1, Regular papers & short notes

    Japanese journal of applied physics. Pt. 1, Regular papers & short notes 42(11), 7112-7115, 2003-11-15

    公益社団法人 応用物理学会

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各種コード

  • NII論文ID(NAID)
    10012564878
  • NII書誌ID(NCID)
    AA10457675
  • 本文言語コード
    EN
  • 資料種別
    ART
  • 雑誌種別
    大学紀要
  • ISSN
    0021-4922
  • NDL 記事登録ID
    6753134
  • NDL 雑誌分類
    ZM35(科学技術--物理学)
  • NDL 請求記号
    Z53-A375
  • データ提供元
    CJP書誌  NDL  J-STAGE  JSAP 
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