Ti超塑性合金を用いたマイクロ金型の製造技術 Development of Micro-Dies Using Titanium Super Plastic Alloy

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We have developed a fabrication technique of micro-dies made of titanium super plastic alloy. Shapes of micro silicon structures, which are formed on a silicon substrate by micromachining technique, were imprinted to titanium super plastic alloy using a vacuum press machine at a temperature of 720 °C. We investigated the method to flatten the sidewall of dry-etched silicon structures, and obtained the surface roughness of less than 10 nm. A graded layer of TiN/Ti film, which is deposited on the silicon microstructures by sputtering, was also examined to prevent titanium diffusion into the silicon microstructures during the high temperature pressing. Using the developed technique, a concave titanium super plastic alloy mold for an optical wave-guide was successfully produced, exhibiting filling factor of 99.58%.

収録刊行物

  • 電気学会論文誌. E, センサ・マイクロマシン準部門誌 = The transactions of the Institute of Electrical Engineers of Japan. A publication of Sensors and Micromachines Society

    電気学会論文誌. E, センサ・マイクロマシン準部門誌 = The transactions of the Institute of Electrical Engineers of Japan. A publication of Sensors and Micromachines Society 124(4), 129-135, 2004-04-01

    The Institute of Electrical Engineers of Japan

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各種コード

  • NII論文ID(NAID)
    10012704013
  • NII書誌ID(NCID)
    AN1052634X
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    13418939
  • NDL 記事登録ID
    6909599
  • NDL 雑誌分類
    ZN31(科学技術--電気工学・電気機械工業)
  • NDL 請求記号
    Z16-B380
  • データ提供元
    CJP書誌  CJP引用  NDL  J-STAGE 
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