TEM observation of the Al and Cu interface bonded at room temperature by means of the surface activation method

• SUGA T

収録刊行物

• J. Jpn. Inst. Metals

  J. Jpn. Inst. Metals 54 713-719, 1990

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• CRID: 1572261550004638080
• NII論文ID: 10012932631
• NII書誌ID: AN00062446
• データソース種別:
  • CiNii Articles