書誌事項
- タイトル別名
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- Effects of Cationic Surfactants on Ni/SiC Composite Plating
- Ni SiC フクゴウメッキ ニ タイスル カチオンセイ カイメン カッセイザイ ノ エイキョウ
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抄録
In order to control the SiC content in Ni/SiC composite plating, cationic surface-active agents with different alkyl chain length, which were of the hydrophobic group, were added to a Ni/SiC composite plating bath to change the surface charge of the SiC particles from negative to positive. The influence of the cationic surfactant on the Ni plating was also studied. The crystallite size of Ni deposits decreased with the addition of the cationic surface-active agents, and an excess addition of cationic surface-active agents in the bath caused cracks in the Ni deposits. In the Ni/SiC plating, we can easily control the SiC amount in the Ni/SiC plating between about 10 and 30 vol%, changing the alkyl chain lengths of the added cationic surfactants and their concentration to change the surface potential of SiC particles.<br>
収録刊行物
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- 表面技術
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表面技術 57 (7), 524-528, 2006
一般社団法人 表面技術協会
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詳細情報 詳細情報について
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- CRID
- 1390282679094127488
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- NII論文ID
- 10018008571
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- NII書誌ID
- AN1005202X
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- COI
- 1:CAS:528:DC%2BD28XnvV2ht70%3D
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- ISSN
- 18843409
- 09151869
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- NDL書誌ID
- 8038847
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
- Crossref
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- 抄録ライセンスフラグ
- 使用不可