Ni/SiC複合めっきに対するカチオン性界面活性剤の影響 Effects of Cationic Surfactants on Ni/SiC Composite Plating

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In order to control the SiC content in Ni/SiC composite plating, cationic surface-active agents with different alkyl chain length, which were of the hydrophobic group, were added to a Ni/SiC composite plating bath to change the surface charge of the SiC particles from negative to positive. The influence of the cationic surfactant on the Ni plating was also studied. The crystallite size of Ni deposits decreased with the addition of the cationic surface-active agents, and an excess addition of cationic surface-active agents in the bath caused cracks in the Ni deposits. In the Ni/SiC plating, we can easily control the SiC amount in the Ni/SiC plating between about 10 and 30 vol%, changing the alkyl chain lengths of the added cationic surfactants and their concentration to change the surface potential of SiC particles.<br>

収録刊行物

  • 表面技術 = The Journal of the Surface Finishing Society of Japan  

    表面技術 = The Journal of the Surface Finishing Society of Japan 57(7), 524-528, 2006-07-01 

    The Surface Finishing Society of Japan

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各種コード

  • NII論文ID(NAID)
    10018008571
  • NII書誌ID(NCID)
    AN1005202X
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    09151869
  • NDL 記事登録ID
    8038847
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z17-291
  • データ提供元
    CJP書誌  CJP引用  NDL  J-STAGE 
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