A Four-Level-Metal Fullly Planarized Interconnect Technology for Dense High Performance Logic and SRAM Applications

• UTTECHT R. R.

収録刊行物

• Proc. IEEE VLSI Multilev. Intercon. Conf. (V-MIC), Santa Clara 1992

  Proc. IEEE VLSI Multilev. Intercon. Conf. (V-MIC), Santa Clara 1992 1992

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• CRID: 1572824500207770368
• NII論文ID: 10018010642
• データソース種別:
  • CiNii Articles