ヒートサイクル信頼性評価中での配線間に生ずる熱残留応力の有限要素解析による予測 Prediction for Thermal Residual Stress between Electric Wires during Reliability Assessment by Heat Cycle Test with Finite Element Analysis

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In recent years, the study of Chip on Board (COB) structures with LSI chips mounted on the substrate has attracted much attention. One of the main technical problems is that the internal electrical wires may disconnect during the heat cycle process due to the differences in the thermal expansion coefficients between component materials. In order to prevent thermal expansion deformation the wires are encased in resin. Until now, the relationship between the physical properties of the resin and the thermal residual stress in the wires has been seldom reported.In this work, the influence of resin physical properties on the thermal residual stress generated during the heat cycle process was theoretically analyzed via finite element analysis. The results show that the thermal residual stress generated in the wire during the heating process is larger than that during the cooling process. During heating the thermal residual stress was influenced by the storage modulus of the rubbery state (ER).

In recent years, the study of Chip on Board (COB) structures with LSI chips mounted on the substrate has attracted much attention. One of the main technical problems is that the internal electrical wires may disconnect during the heat cycle process due to the differences in the thermal expansion coefficients between component materials. In order to prevent thermal expansion deformation the wires are encased in resin. Until now, the relationship between the physical properties of the resin and the thermal residual stress in the wires has been seldom reported.<br>In this work, the influence of resin physical properties on the thermal residual stress generated during the heat cycle process was theoretically analyzed via finite element analysis. The results show that the thermal residual stress generated in the wire during the heating process is larger than that during the cooling process. During heating the thermal residual stress was influenced by the storage modulus of the rubbery state (E<sub>R</sub>).

収録刊行物

  • 成形加工  

    成形加工 18(2), 149-155, 2006-02-20 

    The Japan Society of Polymer Processing = プラスチック成形加工学会

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各種コード

  • NII論文ID(NAID)
    10018109183
  • NII書誌ID(NCID)
    AN10278882
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    09154027
  • NDL 記事登録ID
    7852552
  • NDL 雑誌分類
    ZP17(科学技術--化学・化学工業--高分子化学・高分子化学工業--ゴム・プラスチックス)
  • NDL 請求記号
    Z17-1254
  • データ提供元
    CJP書誌  NDL  IR  J-STAGE 
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