電子パッケージの高精度な熱変位・熱ひずみ分布の計測 High-Accuracy Measurement on Thermal Displacement and Strain Distributions of Electronic Packaging

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The thermal deformation of electronic package, QFP (Quad Flat Package), was measured by phase-shifting moiré interferometry. This method was developed using a wedge-glass-plate as a phase-shifter to obtain the displacement fields with the sensitivity of 80 nm/line. Digital image processing was also introduced to determine the strain distributions quantitatively. Thermal loading was applied by heating the package from room temperature 25°C to an elevated temperature 100°C. The result showed that the normal and shear strains concentrated in the packaging resins around the silicon chip, mount island, and lead frames.

収録刊行物

  • 電気学会論文誌. C, 電子・情報・システム部門誌 = The transactions of the Institute of Electrical Engineers of Japan. C, A publication of Electronics, Information and System Society  

    電気学会論文誌. C, 電子・情報・システム部門誌 = The transactions of the Institute of Electrical Engineers of Japan. C, A publication of Electronics, Information and System Society 126(7), 871-876, 2006-07-01 

    The Institute of Electrical Engineers of Japan

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各種コード

  • NII論文ID(NAID)
    10018146505
  • NII書誌ID(NCID)
    AN10065950
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    03854221
  • NDL 記事登録ID
    8022557
  • NDL 雑誌分類
    ZN31(科学技術--電気工学・電気機械工業)
  • NDL 請求記号
    Z16-795
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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