電子パッケージの高精度な熱変位・熱ひずみ分布の計測 [in Japanese] High-Accuracy Measurement on Thermal Displacement and Strain Distributions of Electronic Packaging [in Japanese]
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The thermal deformation of electronic package, QFP (Quad Flat Package), was measured by phase-shifting moiré interferometry. This method was developed using a wedge-glass-plate as a phase-shifter to obtain the displacement fields with the sensitivity of 80 nm/line. Digital image processing was also introduced to determine the strain distributions quantitatively. Thermal loading was applied by heating the package from room temperature 25°C to an elevated temperature 100°C. The result showed that the normal and shear strains concentrated in the packaging resins around the silicon chip, mount island, and lead frames.
- IEEJ Transactions on Electronics, Information and Systems
IEEJ Transactions on Electronics, Information and Systems 126(7), 871-876, 2006-07-01
The Institute of Electrical Engineers of Japan