A Thermal Model of a Forced-Cooled Heat Sink for Transient Temperature Calculations Employing a Circuit Simulator

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Power semiconductors can be modeled as a thermal network of resistors and capacitors. The thermal boundary condition of such a model is typically defined as the heat sink surface temperature, which is assumed to be constant. In reality, the heat sink surface temperature underneath the power module is not exactly known. In this paper we show how to set up a thermal model of the heat sink in form of a RC thermal equivalent network that can be directly embedded in any circuit simulator. The proposed thermal heat sink model takes into account convection cooling, thermal hotspots on the heat sink base plate, thermal time constants of the heat sink, and thermal coupling between different power modules mounted onto the heat sink. Experimental results are given and show high accuracy of the heat sink model with temperature errors below 10%.

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  • 電気学会論文誌. D, 産業応用部門誌 = The transactions of the Institute of Electrical Engineers of Japan. D, A publication of Industry Applications Society  

    電気学会論文誌. D, 産業応用部門誌 = The transactions of the Institute of Electrical Engineers of Japan. D, A publication of Industry Applications Society 126(7), 841-851, 2006-07-01 

    The Institute of Electrical Engineers of Japan

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各種コード

  • NII論文ID(NAID)
    10018146637
  • NII書誌ID(NCID)
    AN10012320
  • 本文言語コード
    ENG
  • 資料種別
    ART
  • ISSN
    09136339
  • NDL 記事登録ID
    8023473
  • NDL 雑誌分類
    ZN31(科学技術--電気工学・電気機械工業)
  • NDL 請求記号
    Z16-1608
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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