Preparation of Fine Hollow Particles by Polymerization of Vesicles and Their Application to Functional Materials

  • SHIBA Yuichi
    Department of Pure and Applied Chemistry, Faculty of Science and Technology, Tokyo University of Science Corporate Research Center, Mitsubishi Paper Mills Limited
  • NAKAMURA Yukiaki
    Department of Pure and Applied Chemistry, Faculty of Science and Technology, Tokyo University of Science
  • OYAIZU Kenichi
    Institute of Colloid and Interface Science, Tokyo University of Science
  • YUASA Makoto
    Department of Pure and Applied Chemistry, Faculty of Science and Technology, Tokyo University of Science Institute of Colloid and Interface Science, Tokyo University of Science

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Other Title
  • ベシクルの重合による中空型微粒子の調製と機能性材料への応用
  • ベシクル ノ ジュウゴウ ニ ヨル チュウクウガタ ビリュウシ ノ チョウセイ ト キノウセイ ザイリョウ エ ノ オウヨウ

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Abstract

We focused on hollow fine particles formed by polymerization of vesicles as functional materials which have low density and good heat isolation. The polymerizable vesicles were prepared by mixing of vinylbenzyltrimethylammonium chloride (VBTAC) as a polymerizable cation surfactant, sodium dodecyl sulfate (SDS) as an anion surfactant, and divinylbenzene (DVB) as a cross-linker in water. Polymerizable vesicles were observed by TEM. The vesicles could form from the three components of VBTAC, SDS, and DVB exclusively. Polymerization of the vesicles with water-soluble polymerization initiator was confirmed by analysis with 13C-NMR and UV-vis spectroscopy. Fine solid particles obtained by freeze-drying of the polymerized vesicles were observed by SEM. The viscosity of the polymerized vesicles solution increased rapidly at relatively low solid content because the fine particles were very bulky due to the hollow shape. As an application of this fine hollow polymer particles to heat isolation materials, paper sheets which had a thin layer of the polymer particles were evaluated on thermal recording printer. The optical density of printed area of the sheets containing a heat isolation layer was increased due to enhanced heat efficiency for imaging.

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