反応性電子サイクロトロン共鳴(ECR)スパッタ法によるフェライト薄膜の低温高速作製 Low Temperature and High Rate Deposition of Ferrite Thin Films by Reactive Sputtering Method Using Electron Cyclotron Eesonance

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  A reactive sputtering apparatus utilizing electron cyclotron resonance (ECR) was developed for the deposition of thick oxide or nitride films usable in electric devices. A high deposition rate of 44 nm/min. was achieved using a conic alloy target and the deposited soft ferrite thin films were successfully crystallized without heat treatment during film deposition. Magnetic and physical properties for the film were analyzed in terms of saturation magnetization, coercivity, uniformity of film thickness, and inner stress. Obtained properties were consistent with soft magnetic films. The result confirms the oxygen partial pressure ratio to deposition rate strongly affected the magnetic properties. Well crystallized, ultra thin 3-nm-thick Ni-Zn ferrite (100) films, were also successfully deposited on MgO (100) underlayers. These results imply the ECR sputtering method is one of the most effective deposition methods for highly crystallized polycrystalline thick and thin films. Crystal orientation was improved by low target voltage sputtering as well as a relatively low deposition rate. Further improvement is considered to be possible by deposition at lower base pressures.<br>

収録刊行物

  • 真空 = JOURNAL OF THE VACUUM SOCIETY OF JAPAN  

    真空 = JOURNAL OF THE VACUUM SOCIETY OF JAPAN 49(7), 424-429, 2006-07-20 

    The Vacuum Society of Japan

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各種コード

  • NII論文ID(NAID)
    10018210320
  • NII書誌ID(NCID)
    AN00119871
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    05598516
  • NDL 記事登録ID
    8058324
  • NDL 雑誌分類
    ZN15(科学技術--機械工学・工業--流体機械)
  • NDL 請求記号
    Z16-474
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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