Effects of Metallo-Organic Decomposition Agents on Thermal Decomposition and Electrical Conductivity of Low-Temperature-Curing Silver Paste

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著者

    • Lu Chun-An Lu Chun-An
    • Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu, Taiwan, R.O.C.
    • Lin Pang Lin Pang
    • Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu, Taiwan, R.O.C.
    • Wang Sea-Fue
    • Department of Materials and Mineral Resources Engineering, National Taipei University of Technology, Taipei, Taiwan, R.O.C.

抄録

Six low-temperature-curing silver pastes were prepared from silver flake, $\alpha$-terpineol and various metallo-organic decomposition (MOD) compounds. The thermal decomposition behaviors of the pastes were determined. The microstructures and resistivities of screen-printed films on alumina substrate after thermal treatment were characterized and discussed. Results indicated that 2-ethylhexanoate possesses the lowest decomposition temperature (190.3 °C) among the MOD agents studied, and it forms silver particles to promote the linking of silver flake powders and thus reduces the resistivity to ${<}13$ μ$\Omega$$\cdot$cm at a temperature as low as 200 °C.

収録刊行物

  • Japanese journal of applied physics. Pt. 1, Regular papers & short notes

    Japanese journal of applied physics. Pt. 1, Regular papers & short notes 45(9A), 6987-6992, 2006-09-15

    Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physics

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各種コード

  • NII論文ID(NAID)
    10018245961
  • NII書誌ID(NCID)
    AA10457675
  • 本文言語コード
    EN
  • 資料種別
    ART
  • 雑誌種別
    大学紀要
  • ISSN
    0021-4922
  • NDL 記事登録ID
    8055911
  • NDL 雑誌分類
    ZM35(科学技術--物理学)
  • NDL 請求記号
    Z53-A375
  • データ提供元
    CJP書誌  NDL  JSAP 
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