遠心焼結によるCu厚膜の緻密化とクラック除去 Densification and Removal of Crack in Cu Thick Film by Centrifugal Sintering
Films with thickness ranging from several ten μm to several mm are of great interest due to their application or necessity in highly integrated, small electric devices. In this work, we report the processing merit of a novel centrifugal sintering, which densifies metallic film by applying high pressure, in the absence of a pressure medium such as graphite bar in hot-pressing equipment. Cu thick film on SiO<sub>2</sub> substrate has been prepared for studying the sintering behaviour. It is observed that the pores and cracks in the specimens were drastically removed, and then promoted its densification by centrifugal firing, compared with conventional firing.
粉体および粉末冶金 52(10), 763-766, 2005-10-15
Japan Society of Powder and Powder Metallurgy