Densification and Removal of Crack in Cu Thick Film by Centrifugal Sintering

• Watari Koji

  National Institute of Advanced Industrial Science and Technology

• Kinemuchi Yoshiaki

  National Institute of Advanced Industrial Science and Technology

• Ishiguro Hiroyuki

  Sinto V-Cerax LTD.

• Morimitsu Hideki

  Sinto V-Cerax LTD.

• Uchimura Shoji

  Sinto V-Cerax LTD.

Bibliographic Information

Other Title

• 遠心焼結によるＣｕ厚膜のち密化とクラック除去
• 遠心焼結によるCu厚膜の緻密化とクラック除去
• エンシン ショウケツ ニ ヨル Cu コウマク ノ チミツカ ト クラック ジョキョ

Abstract

Films with thickness ranging from several ten μm to several mm are of great interest due to their application or necessity in highly integrated, small electric devices. In this work, we report the processing merit of a novel centrifugal sintering, which densifies metallic film by applying high pressure, in the absence of a pressure medium such as graphite bar in hot-pressing equipment. Cu thick film on SiO₂ substrate has been prepared for studying the sintering behaviour. It is observed that the pores and cracks in the specimens were drastically removed, and then promoted its densification by centrifugal firing, compared with conventional firing.

Journal

• Journal of the Japan Society of Powder and Powder Metallurgy

  Journal of the Japan Society of Powder and Powder Metallurgy 52 (10), 763-766, 2005

  Japan Society of Powder and Powder Metallurgy

Keywords

• Centrifugal sintering
• thick film
• Cu
• substrate
• pore
• crack

Details

• CRID: 1390001206307280000
• NII Article ID: 10018283485
• NII Book ID: AN00222724
• DOI: 10.2497/jjspm.52.763
• ISSN: 18809014
• ISSN: 05328799
• NDL BIB ID: 7709779
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I7709779
• Text Lang: ja
• Data Source:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
• Abstract License Flag: Disallowed