書誌事項
- タイトル別名
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- Densification and Removal of Crack in Cu Thick Film by Centrifugal Sintering
- 遠心焼結によるCu厚膜の緻密化とクラック除去
- エンシン ショウケツ ニ ヨル Cu コウマク ノ チミツカ ト クラック ジョキョ
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抄録
Films with thickness ranging from several ten μm to several mm are of great interest due to their application or necessity in highly integrated, small electric devices. In this work, we report the processing merit of a novel centrifugal sintering, which densifies metallic film by applying high pressure, in the absence of a pressure medium such as graphite bar in hot-pressing equipment. Cu thick film on SiO2 substrate has been prepared for studying the sintering behaviour. It is observed that the pores and cracks in the specimens were drastically removed, and then promoted its densification by centrifugal firing, compared with conventional firing.
収録刊行物
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- 粉体および粉末冶金
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粉体および粉末冶金 52 (10), 763-766, 2005
一般社団法人 粉体粉末冶金協会
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詳細情報 詳細情報について
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- CRID
- 1390001206307280000
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- NII論文ID
- 10018283485
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- NII書誌ID
- AN00222724
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- ISSN
- 18809014
- 05328799
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- NDL書誌ID
- 7709779
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可