Preparation and Various Characteristics of Epoxy/Alumina Nanocomposites
Epoxy/ alumina nanocomposites were newly prepared by dispersing 3, 5, 7, and 10 weight (wt) % boehmite alumina nanofillers in a bisphenol-A epoxy resin using a special two-stage direct mixing method. It was confirmed by scanning electron microscopy imaging that the nanofillers were homogeneously dispersed in the epoxy matrix. Dielectric, mechanical, and thermal properties were investigated. It was elucidated that nanofillers affects various characteristics of epoxy resins, when they are nanostructrued. Such nano-effects we obtained are summarized as follows. Partial discharge resistance increases as the filler content increases; e.g. 7 wt% nanofiller content creates a 60 % decrease in depth of PD-caused erosion. Weibull analysis shows that short-time electrical treeing breakdown time is prolonged to 265 % by 5 wt% addition of nanofillers. But there was more data scatter in nanocomposites than in pure epoxy. Permittivity tends to increase from 3.7 to 4.0 by 5 wt% nanofiller addition as opposed to what was newly found in the recent past. Glass transition temperature remains unchanged as 109 °C. Mechanical properties such as flexural strength and flexural modulus increase; e.g. flexural strength and flexural modulus are improved by 5 % and 8 % with 5 wt% content, respectively. Excess addition causes a reverse effect. It is concluded from permittivity and glass transition temperature characteristics that interfacial bonding seems to be more or less weak in the nanocomposite specimens prepared this time, even though mechanical strengths increase. There is a possibility that the nanocomposites specimens will be improved in interfacial quality.
- 電気学会論文誌. A, 基礎・材料・共通部門誌 = The transactions of the Institute of Electrical Engineers of Japan. A, A publication of Fundamentals and Materials Society
電気学会論文誌. A, 基礎・材料・共通部門誌 = The transactions of the Institute of Electrical Engineers of Japan. A, A publication of Fundamentals and Materials Society 126(11), 1121-1127, 2006-11-01
The Institute of Electrical Engineers of Japan