Approach by Nano- and Micro-filler Mixture toward Epoxy-based Nanocomposites as Industrial Insulating Materials

  • Imai Takahiro
    Power and Industrial Systems R&D Center, Toshiba Corporation
  • Sawa Fumio
    Power and Industrial Systems R&D Center, Toshiba Corporation
  • Ozaki Tamon
    Power and Industrial Systems R&D Center, Toshiba Corporation
  • Shimizu Toshio
    Power and Industrial Systems R&D Center, Toshiba Corporation
  • Kuge Shin-ichi
    Graduate School of Information, Production and Systems, Waseda University
  • Kozako Masahiro
    Advanced Research Institute for Science and Engineering, Waseda University
  • Tanaka Toshikatsu
    Graduate School of Information, Production and Systems, Waseda University

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Abstract

The main contribution of this paper is to show the realizability of epoxy-based nanocomposites as industrial insulating materials. The nano- and micro-filler mixture was invented to boost the nanocomposite in industrial insulating materials. Nano- and micro-filler mixture composites were newly made by dispersing a few weight-percentages of nano-filler and approximately 60 weight-percentages of micro-silica fillers in epoxy resin. Two kinds of nano-filler were used, such as layered silicate and silica. Experimental results demonstrated that the approach by nano- and micro-filler mixture enables the nanocomposite to have not only superior insulation properties but also the same low thermal expansion in comparison with the conventional filled epoxy (approximately 60 weight-percentages of micro-silica loading). Moreover, the nano-silica and micro-filler mixture composite has the desired properties of resin viscosity and curing reaction whereas the layered silicate and micro-filler composite has higher resin viscosity and faster curing reaction than those of the conventional filled epoxy due to modifier ions of layered silicates. Consequently, the nano-silica and micro-filler mixture composite is presently the closest to the epoxy-based nanocomposite as an industiral insulation material.

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