はんだバンプに発生した微小ボイドの自動検出 Automated Detection of Micro Void in Solder Bump
In the flip chip junction, void in the solder bump has serious influences on reliability and electric characteristic. In this paper, we propose an automated detection technique of micro voids in solder bump. The void makes hollow on the bump shape in X-ray image. We developed subtraction-based method by means of combination of morphology filter and image subtraction to detect the voids. Furthermore, we introduced noise elimination method using some void feature values and discriminant analysis. We evaluated this technique using simulation model and real bump. As a result, a correct rate reached 99.2%, which demonstrates this technique has very high detection ability.
- 電気学会論文誌. D, 産業応用部門誌 = The transactions of the Institute of Electrical Engineers of Japan. D, A publication of Industry Applications Society
電気学会論文誌. D, 産業応用部門誌 = The transactions of the Institute of Electrical Engineers of Japan. D, A publication of Industry Applications Society 126(11), 1514-1521, 2006-11-01
The Institute of Electrical Engineers of Japan