はんだバンプに発生した微小ボイドの自動検出 [in Japanese] Automated Detection of Micro Void in Solder Bump [in Japanese]
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In the flip chip junction, void in the solder bump has serious influences on reliability and electric characteristic. In this paper, we propose an automated detection technique of micro voids in solder bump. The void makes hollow on the bump shape in X-ray image. We developed subtraction-based method by means of combination of morphology filter and image subtraction to detect the voids. Furthermore, we introduced noise elimination method using some void feature values and discriminant analysis. We evaluated this technique using simulation model and real bump. As a result, a correct rate reached 99.2%, which demonstrates this technique has very high detection ability.
- IEEJ Transactions on Sensors and Micromachines
IEEJ Transactions on Sensors and Micromachines 126(11), 1514-1521, 2006-11-01
The Institute of Electrical Engineers of Japan