Self-formation of Thin Barrier Metal Layers in Cu (Ti) Alloy Metallization

• Tsukimoto Susumu

  Department of Materials Science and Engineering. Kyoto University

• Onishi Takashi

  Materials Research Laboratory, Kobe Steel, Ltd.

• Ito Kazuhiro

  Department of Materials Science and Engineering. Kyoto University

• Murakami Masanori

  Department of Materials Science and Engineering. Kyoto University

• Konno Mitsuru

  Naka Application Center, Hitachi High-Technologies

• Yaguchi Toshie

  Naka Application Center, Hitachi High-Technologies

• Kamino Takeo

  Naka Application Center, Hitachi High-Technologies

Bibliographic Information

Other Title

• Cu (Ti) 合金微細配線における極薄バリア層の自己組織形成

Journal

• Materia Japan

  Materia Japan 45 (12), 879-879, 2006

  The Japan Institute of Metals and Materials

Keywords

• Cu (Ti) alloy
• metallization
• barrier layer
• self-formation
• high-pressure anneal

Details

• CRID: 1390001204078542464
• NII Article ID: 10018421961
• NII Book ID: AN10433227
• DOI: 10.2320/materia.45.879
• ISSN: 18845843
• ISSN: 13402625
• Web Site: https://www.jstage.jst.go.jp/article/materia1994/45/12/45_12_879/_pdf
• Data Source:
  • JaLC
  • Crossref
  • CiNii Articles
  • KAKEN