Design of Dismantlable Structural Adhesives with High Temperature Performance

• KISHI Hajime

• INADA Yuichiro

• IMADE Jin

• UESAWA Kazuhiko

• MATSUDA Satoshi

• SATO Chiaki

• MURAKAMI Atsushi

Bibliographic Information

Other Title

• 解体性と耐熱性を兼備した構造用接着剤の組成設計
• カイタイセイ ト タイネツセイ オ ケンビ シタ コウゾウヨウ セッチャクザイ ノ ソセイ セッケイ

Abstract

The aim of this study is to design dismantlable structural epoxy adhesives with heat-resistant adhesive properties. Epoxy resin formulations using glycidyl phthalimide (GPI) with high polarity of imide structure as a mono-functional epoxy possessed relatively high Tg and reduced rubbery modulus of the resin at temperature over Tg, compared to the case using other mono-functionalepoxies. Curing agents also had an important role on the heat softening behavior. The combination of dicyandiamide/dichlorophenyldimethylurea as the curing agents showed good balance on high Tg and softening over Tg. These findings led to the cured resin composition including 25% of GPI, which possessed Tg over 80℃, modulus over 3GPa at glass state, and rubbery modulus lower than 2MPa. Consequently, the combination of the resin formulation with GPI and 10% of expandable graphite enabled both good dismantlability over 200℃ by thermal expansion of the graphite and high shear adhesive strength of over 20MPa at 80℃.

Journal

• Journal of The Adhesion Society of Japan

  Journal of The Adhesion Society of Japan 42 (9), 356-363, 2006

  The Adhesion Society of Japan

Details

• CRID: 1390282679252536448
• NII Article ID: 10018428609
• NII Book ID: AN10341672
• DOI: 10.11618/adhesion.42.356
• ISSN: 21874816
• ISSN: 09164812
• NDL BIB ID: 8094246
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I8094246
• Text Lang: ja
• Data Source:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
• Abstract License Flag: Disallowed