Reactive Ion Etching of Transition-Metal Alloys

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  • AKINAGA Hiro
    Nanotechnology Research Institute, National Institute of Advanced Industrial Science and Technology
  • TAKANO Fumiyoshi
    Nanotechnology Research Institute, National Institute of Advanced Industrial Science and Technology
  • MATSUMOTO Shigeno
    Department of Precision Science & Technology and Applied Physics, Osaka University
  • DIÑO Wilson A. T.
    Center for the Promotion of Research on Nanoscience and Nanotechnology, Osaka University College of Science, De La Salle University

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Other Title
  • 遷移金属合金の反応性イオンエッチング
  • センイ キンゾク ゴウキン ノ ハンノウセイ イオンエッチング

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Abstract

  For production of advanced spin-electronic devices, such as a magnetic random access memory with the higher-density memory cell, a reactive ion etching (RIE) process of transition metal alloys is the indispensable component of development, while no transition-metal compounds with the relatively high vapor pressure have been founded so far. Here, we show the RIE process of a NiFe thin film by using CH4:O2:NH3 discharge. The RIE process was designed by ab initio calculations, and the present result is the first successful demonstration of the chemical effect in the RIE process for transition-metal alloys. The relative etching ratio of NiFe against Ti as the metal mask was decreased by substituting CH4 with CHF3.<br>

Journal

  • Shinku

    Shinku 49 (12), 716-721, 2006

    The Vacuum Society of Japan

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