Deterioration Phenomenon of Insulation Layers of High Temperature High Humidity Bias Tests

• OKAMOTO Kenji

  Fuji Electric Advanced Technology

• FUKUNAGA Kaori

  National Institute of Information and Communication Technology

• MAENO Takashi

  National Institute of Information and Communication Technology

Bibliographic Information

Other Title

• 高温高湿バイアス試験における樹脂絶縁層の劣化現象

Journal

• 電気学会研究会資料. DEI, 誘電・絶縁材料研究会

  電気学会研究会資料. DEI, 誘電・絶縁材料研究会 2006 (77), 15-18, 2006-12-18

Keywords

• Metal-base printed circuit board
• high temperature high humidity bias tests
• insulation deterioration
• Space charge
• pulsed electroacoustic method
• electric field enhancement

Details

• CRID: 1572824500207840768
• NII Article ID: 10018459612
• NII Book ID: AN10388224
• Text Lang: ja
• Data Source:
  • CiNii Articles