Fast Nanoimprint Thermal Lithography Using a Heated High-Aspect Ratio Mold

この論文にアクセスする

この論文をさがす

著者

    • Nakada Yoshinobu Nakada Yoshinobu
    • Institute of Symbiotic Science and Technology, Tokyo University of Agriculture and Technology, 2-24-16 Naka-cho, Koganei, Tokyo 184-8588, Japan
    • Ninomiya Kenrou Ninomiya Kenrou
    • Institute of Symbiotic Science and Technology, Tokyo University of Agriculture and Technology, 2-24-16 Naka-cho, Koganei, Tokyo 184-8588, Japan
    • Takaki Yasuhiro Takaki Yasuhiro
    • Institute of Symbiotic Science and Technology, Tokyo University of Agriculture and Technology, 2-24-16 Naka-cho, Koganei, Tokyo 184-8588, Japan

抄録

The throughput of the thermal nanoimprint lithography is improved. The proposed process uses a high-aspect ratio mold. The mold is heated to temperatures above the glass transition temperature of the resist, and only the top part of the mold is used to press the resist. The mold press time, the resist cooling time, and the mold releasing time can be reduced. A line pattern having a width of 100 nm and a pitch of 400 nm, and a dot pattern having a diameter of 75 nm and a pitch of 200 nm were successfully transferred to the resist using SiC molds. The imprint time was 5 s.

収録刊行物

  • Japanese journal of applied physics. Pt. 2, Letters  

    Japanese journal of applied physics. Pt. 2, Letters 45(46), L1241-L1243, 2006-12-25 

    Japan Society of Applied Physics

参考文献:  8件

参考文献を見るにはログインが必要です。ユーザIDをお持ちでない方は新規登録してください。

各種コード

  • NII論文ID(NAID)
    10018460879
  • NII書誌ID(NCID)
    AA10650595
  • 本文言語コード
    EN
  • 資料種別
    SHO
  • ISSN
    0021-4922
  • NDL 記事登録ID
    8589644
  • NDL 雑誌分類
    ZM35(科学技術--物理学)
  • NDL 請求記号
    Z54-J337
  • データ提供元
    CJP書誌  NDL  JSAP 
ページトップへ