LIGAプロセスの三次元化とスパイラル型マイクロコイルの作製 Development of a 3-Dimensional LIGA Process and Application to Fabricate a Spiral Microcoil

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LIGA process has been developed in the 2.5-dimensional world. We introduced new technologies of a 3D X-ray lithography and a worm injection molding with an unscrewing demolding mechanism, and succeeded in the deployment of a three- dimensional LIGA process. Furthermore, it succeeded to fabricate a spiral microcoil using 3D-LIGA process and a metallization technique combined flat and smooth electroplating and isotropic chemical etching. A diameter of the microcoil was 0.5 mm and the length was 1 mm. The width of coil lines was 10 μm, and the pitch was 20 μm. Also the characteristics as an inductor of this microcoil is such that the inductance and the quality factor at the frequency of 1 GHz was 91 nH and 5.8, respectively.

収録刊行物

  • 電気学会論文誌. C, 電子・情報・システム部門誌 = The transactions of the Institute of Electrical Engineers of Japan. C, A publication of Electronics, Information and System Society  

    電気学会論文誌. C, 電子・情報・システム部門誌 = The transactions of the Institute of Electrical Engineers of Japan. C, A publication of Electronics, Information and System Society 127(2), 160-166, 2007-02-01 

    The Institute of Electrical Engineers of Japan

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各種コード

  • NII論文ID(NAID)
    10018480428
  • NII書誌ID(NCID)
    AN10065950
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    03854221
  • NDL 記事登録ID
    8668212
  • NDL 雑誌分類
    ZN31(科学技術--電気工学・電気機械工業)
  • NDL 請求記号
    Z16-795
  • データ提供元
    CJP書誌  CJP引用  NDL  J-STAGE 
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