光ナノインプリント用光硬化性樹脂とその特性評価法 Photo-curable Resins and the Evaluation Methods for UV-Nanoimprint Lithography

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We prepared five kinds of photo-curable resins, and conducted evaluation experiments for their thermal properties, mechanical properties, and application availability for the imprint process. Measurements of thermal properties using the TG method, TM-DSC method, and laser interferometric method were studied. From these measurements, it was found that the measurements of the thermally stable temperature, glass-transition temperature, and linear expansion coefficient of the resins were possible. Also, measurements of mechanical properties using the nano indentation were studied. In this method, the measurements of Young's modulus of the thin resin film on the substrate were possible. With respect to application availability for the imprint process, we investigated effects of the mold release treatment and their durability for two kinds of resins by measuring their adhesive force. It was observed that the difference in durability of mold release treatment effects depends on the resin type.

収録刊行物

  • 電気学会論文誌. C, 電子・情報・システム部門誌 = The transactions of the Institute of Electrical Engineers of Japan. C, A publication of Electronics, Information and System Society  

    電気学会論文誌. C, 電子・情報・システム部門誌 = The transactions of the Institute of Electrical Engineers of Japan. C, A publication of Electronics, Information and System Society 127(2), 174-178, 2007-02-01 

    The Institute of Electrical Engineers of Japan

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各種コード

  • NII論文ID(NAID)
    10018480445
  • NII書誌ID(NCID)
    AN10065950
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    03854221
  • NDL 記事登録ID
    8668281
  • NDL 雑誌分類
    ZN31(科学技術--電気工学・電気機械工業)
  • NDL 請求記号
    Z16-795
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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