複雑三次元形状物へのパルスプラズマによるDLC成膜と産業応用 DLC Film Formation Technologies by Applying Pulse Voltage Coupled with RF Voltage to Complicated 3-dimensional Substrates and Industrial Application

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A uniform plasma-based ion implantation and DLC film formation technologies on the surface of complicated 3-dimensional substrates have been developed by applying pulse voltage coupled with RF voltage to the substrates such as plastics, rubber as well as metals with the similar deposition rate. These technologies are widely applicable to both ion implantation and DLC film formation onto the automobile parts, mechanical parts and metal molds. A problem to be solved is reducing cost. The deposition rate of DLC films is expected to increase to around 10μm/hr, which is ten times larger than that of the conventional method, by hybridizing the ICP (Induction Coupling Plasma) with a plus-minus voltage source. This epoch-making technology will be able to substitute for the electro-plating method in the near future.<br>In this paper, the DLC film formation technology by applying both RF and pulse voltage, its applications and its prospect are presented.

収録刊行物

  • 電気学会論文誌. B, 電力・エネルギー部門誌 = The transactions of the Institute of Electrical Engineers of Japan. B, A publication of Power and Energy Society  

    電気学会論文誌. B, 電力・エネルギー部門誌 = The transactions of the Institute of Electrical Engineers of Japan. B, A publication of Power and Energy Society 127(2), 349-352, 2007-02-01 

    The Institute of Electrical Engineers of Japan

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各種コード

  • NII論文ID(NAID)
    10018480681
  • NII書誌ID(NCID)
    AN10136334
  • 本文言語コード
    JPN
  • 資料種別
    REV
  • ISSN
    03854213
  • NDL 記事登録ID
    8669016
  • NDL 雑誌分類
    ZN31(科学技術--電気工学・電気機械工業)
  • NDL 請求記号
    Z16-794
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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