The Present and Future Trends in Electroless Copper Plating

• SHIMIZU Satoru

  Central Res. Lab., Ebara Udylite Co., Ltd.

Bibliographic Information

Other Title

• 無電解銅めっきの現状と将来
• ムデンカイ ドウメッキ ノ ゲンジョウ ト ショウライ

Journal

• Journal of The Surface Finishing Society of Japan

  Journal of The Surface Finishing Society of Japan 58 (2), 81-81, 2007

  The Surface Finishing Society of Japan

Keywords

• Electroless Copper Plating

Details

• CRID: 1390282679094209024
• NII Article ID: 10018542945
• NII Book ID: AN1005202X
• DOI: 10.4139/sfj.58.81
• COI: 1:CAS:528:DC%2BD2sXktFygu74%3D
• ISSN: 18843409
• ISSN: 09151869
• NDL BIB ID: 8685975
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I8685975
• Web Site: https://www.jstage.jst.go.jp/article/sfj/58/2/58_2_81/_pdf
• Text Lang: ja
• Data Source:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles