Forming Tapered Pattern by Cu Electrodeposition Through Mask on Ni Seed Layer for Thin-Film Transistors
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- JENQ Shrane Ning
- Department of Chemical Engineering, National Tsing Hua University
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- WAN Chi Chao
- Department of Chemical Engineering, National Tsing Hua University
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- WANG Yung Yun
- Department of Chemical Engineering, National Tsing Hua University
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- LI Hung Wei
- Display Institute, National Chiao Tung University
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- LIU Po Tsun
- Display Institute, National Chiao Tung University
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- CHEN Jing Hon
- Quanta Display Inc.
Search this article
Journal
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- Japanese journal of applied physics. Pt. 2, Letters
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Japanese journal of applied physics. Pt. 2, Letters 45 (42), L1215-L1218, 2006-11-25
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Details 詳細情報について
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- CRID
- 1572261550274800128
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- NII Article ID
- 10018632622
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- NII Book ID
- AA10650595
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- ISSN
- 00214922
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- Text Lang
- en
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- Data Source
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- CiNii Articles