Forming Tapered Pattern by Cu Electrodeposition Through Mask on Ni Seed Layer for Thin-Film Transistors

• JENQ Shrane Ning

  Department of Chemical Engineering, National Tsing Hua University

• WAN Chi Chao

  Department of Chemical Engineering, National Tsing Hua University

• WANG Yung Yun

  Department of Chemical Engineering, National Tsing Hua University

• LI Hung Wei

  Display Institute, National Chiao Tung University

• LIU Po Tsun

  Display Institute, National Chiao Tung University

• CHEN Jing Hon

  Quanta Display Inc.

収録刊行物

• Japanese journal of applied physics. Pt. 2, Letters

  Japanese journal of applied physics. Pt. 2, Letters 45 (42), L1215-L1218, 2006-11-25

キーワード

• Cu
• acid pretreatment
• electrodeposition
• Ni seed layer
• thin-film transistors

詳細情報

• CRID: 1572261550274800128
• NII論文ID: 10018632622
• NII書誌ID: AA10650595
• ISSN: 00214922
• 本文言語コード: en
• データソース種別:
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