塩化亜鉛めっき浴からのパルス電解 Pulse Plating from Chloride Zinc Bath

この論文にアクセスする

この論文をさがす

著者

抄録

Pulse plating was used to prepare a zinc deposit from a zinc chloride bath with and without poly(ethylene glycols) and potassium benzoate as additives. The influence of additive and pulse plating parameters, namely, <i>t</i><sub>on</sub> time=1 ms, <i>T</i><sub>off</sub> time=4 ms-19 ms and average current density=1 Adm<sup>−2</sup>-5 Adm<sup>−2</sup> on grain size, surface morphology and preferred orientation was investigated. The surface morphology of zinc deposits was studied by scanning electron microscopy. The grain size and preferred orientation of zinc deposits were studied by X-ray diffraction. At constant <i>t</i><sub>on</sub> time=1 ms, the grain size became finer with increasing <i>T</i><sub>off</sub> time from the electrolyte without the additives. On the other hand, a progressive decrease of the grain size was observed with the additives. The (10<span style="text-decoration:overline;">1</span>0) and (11<span style="text-decoration:overline;">2</span>0) orientations were strong preferred orientation at all pulse plating parameters from the electrolyte with and without additives. Current efficiency became high with an increase in average current density.<br>

収録刊行物

  • 表面技術 = The Journal of the Surface Finishing Society of Japan

    表面技術 = The Journal of the Surface Finishing Society of Japan 58(1), 45-51, 2007-01-01

    The Surface Finishing Society of Japan

参考文献:  15件中 1-15件 を表示

  • <no title>

    SAFRANEK W. H.

    The properties of electrodeposited metals and alloys, 1986

    被引用文献1件

  • <no title>

    SCHLESINGER M.

    Moden electroplating, 2000

    被引用文献1件

  • <no title>

    WINAND R.

    Electrochem., Acta 39, 1091, 1994

    被引用文献1件

  • <no title>

    MOUANGA M.

    Surf. Coat. Tech., 2006

    被引用文献1件

  • <no title>

    YOUSSEF Kh. M. S.

    J. Electrochem. Soc. 151, 103, 2004

    被引用文献1件

  • <no title>

    WILSON K. S.

    Tech. Proc. Ame. Electrop ; aters Soc., 1964 50, 92, 1964

    被引用文献1件

  • <no title>

    PANGAROV N. A.

    Electrochim. Acta 9, 721, 1964

    被引用文献1件

  • <no title>

    RAEISSI K.

    J. Appl. Electrochem. 33, 635, 2003

    被引用文献1件

  • <no title>

    MACKINNON D. J.

    J. Appl. Electrochem. 9, 603, 1979

    被引用文献1件

  • <no title>

    YU J.

    J. Electrochem. Soc. 146, 1789, 1999

    被引用文献1件

  • <no title>

    TAGUCHI S.

    J. Electroanal. Chem. 374, 275, 1994

    被引用文献2件

  • <no title>

    TAGUCHI S.

    J. Electroanal. Chem. 457, 73, 1998

    被引用文献1件

  • <no title>

    TREJO G.

    J. Appl. Electrochem. 31, 685, 2001

    被引用文献1件

  • <no title>

    LEE J.

    J. Electrochem. Soc. 151, C25, 2004

    被引用文献1件

  • <no title>

    CHOI Y.

    Surf. and Coat. Tech. 169-170, 81, 2003

    被引用文献2件

各種コード

  • NII論文ID(NAID)
    10018703794
  • NII書誌ID(NCID)
    AN1005202X
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    09151869
  • NDL 記事登録ID
    8658955
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z17-291
  • データ提供元
    CJP書誌  NDL  J-STAGE 
ページトップへ