パルス通電加熱したTi-Ni粉末焼結ターゲットならびにNaCl粉末焼結基板を用いたスパッタ成膜 Sputter-deposited Films from Ti-Ni Target and NaCl Substrate Prepared by Pulsed-current Sintering

この論文にアクセスする

この論文をさがす

著者

    • 小林 慶三 KOBAYASHI Keizo
    • (独)産業技術総合研究所サステナブルマテリアル研究部門 National Institute of Advanced Industrial Science and Technology, Material Research Institute for Sustainable Development
    • 尾崎 公洋 OZAKI Kimihiro
    • (独)産業技術総合研究所サステナブルマテリアル研究部門 National Institute of Advanced Industrial Science and Technology, Material Research Institute for Sustainable Development
    • 三上 祐史 [他] MIKAMI Masashi
    • (独)産業技術総合研究所サステナブルマテリアル研究部門 National Institute of Advanced Industrial Science and Technology, Material Research Institute for Sustainable Development

抄録

Sodium chloride powder has been consolidated using pulsed-current sintering method for the substrate. The utilization of the punch made of Ti-2at%Fe-10at%Si alloy has made it possible to produce a sodium chloride compact with a smooth surface and no reactant. Ti-Ni thin film has been prepared on the sodium chloride substrate by sputtering method. Ti-Ni sputtering target has been prepared using pulsed current sintering of the powder mixture of Ti and Ni powders with the composition of Ti-50at%Ni.<BR>The thickness of Ti-Ni film prepared for the sputtering time of 10.8 ks has been about 70μm. The sputtered Ti-Ni film has been spontaneously separated from the sodium chloride substrate in the water. The film has had an amorphous structure and crystallized at 820 K.

収録刊行物

  • 粉体および粉末冶金  

    粉体および粉末冶金 54(2), 107-111, 2007-02-15 

    Japan Society of Powder and Powder Metallurgy

参考文献:  8件

参考文献を見るにはログインが必要です。ユーザIDをお持ちでない方は新規登録してください。

各種コード

  • NII論文ID(NAID)
    10018736778
  • NII書誌ID(NCID)
    AN00222724
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    05328799
  • NDL 記事登録ID
    8727917
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z17-274
  • データ提供元
    CJP書誌  NDL  J-STAGE 
ページトップへ