パルス通電加熱したTi-Ni粉末焼結ターゲットならびにNaCl粉末焼結基板を用いたスパッタ成膜 Sputter-deposited Films from Ti-Ni Target and NaCl Substrate Prepared by Pulsed-current Sintering
Sodium chloride powder has been consolidated using pulsed-current sintering method for the substrate. The utilization of the punch made of Ti-2at%Fe-10at%Si alloy has made it possible to produce a sodium chloride compact with a smooth surface and no reactant. Ti-Ni thin film has been prepared on the sodium chloride substrate by sputtering method. Ti-Ni sputtering target has been prepared using pulsed current sintering of the powder mixture of Ti and Ni powders with the composition of Ti-50at%Ni.<BR>The thickness of Ti-Ni film prepared for the sputtering time of 10.8 ks has been about 70μm. The sputtered Ti-Ni film has been spontaneously separated from the sodium chloride substrate in the water. The film has had an amorphous structure and crystallized at 820 K.
粉体および粉末冶金 54(2), 107-111, 2007-02-15
Japan Society of Powder and Powder Metallurgy