Fabrication and Characterization of Smooth Si Mold for Hot Embossing Process

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In this paper, we propose a fabrication and characterization of silicon mold for PMMA hot embossing process. Silicon molds were fabricated from silicon wafer with thickness of 500μm. First, DRIE technique was performed after optimized etching time and deposition (passivation) time to obtain a depth of 30μm with positive tapered sidewall of 1°. This is very important for de-molding process while hot embossing. Second, in order to reduce scalloping steps on the sidewall after DRIE, silicon molds were soaked in the TMAH solution 20% at 80°C for 10 minutes without magnetic stirrer. Third, to further reduce the friction coefficient between sidewall surface and PMMA substrate while de-molding, the post-passivation technique was applied to create a thin layer of Teflon-like material on the surface of the sidewall of silicon mold. These smooth silicon molds were used to emboss several models of PMMA patterns and comb-drive actuators, as well as applications in Micro Conveyer System. The PMMA patterns obtained after hot embossing process had very sharp edge and aspect ratio of 15 with minimum feature sized of 2μm.

収録刊行物

  • 電気学会論文誌. E, センサ・マイクロマシン準部門誌 = The transactions of the Institute of Electrical Engineers of Japan. A publication of Sensors and Micromachines Society  

    電気学会論文誌. E, センサ・マイクロマシン準部門誌 = The transactions of the Institute of Electrical Engineers of Japan. A publication of Sensors and Micromachines Society 127(3), 187-191, 2007-03-01 

    The Institute of Electrical Engineers of Japan

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各種コード

  • NII論文ID(NAID)
    10018737873
  • NII書誌ID(NCID)
    AN1052634X
  • 本文言語コード
    ENG
  • 資料種別
    ART
  • ISSN
    13418939
  • NDL 記事登録ID
    8728862
  • NDL 雑誌分類
    ZN31(科学技術--電気工学・電気機械工業)
  • NDL 請求記号
    Z16-B380
  • データ提供元
    CJP書誌  CJP引用  NDL  J-STAGE 
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