Fabrication of Copper Ferrite Thin Films from Aqueous Solution by the Liquid-phase Deposition Method
Liquid-phase deposition, LPD, method was used for the fabrication of copper ferrite (CuFe<SUB>2</SUB>O<SUB>4</SUB>) thin film from aqueous solution system of FeOOH–NH<SUB>4</SUB>·HF (aq.) and Cu source (Cu(NO<SUB>3</SUB>)<SUB>2</SUB> or CuCl<SUB>2</SUB>) with H<SUB>3</SUB>BO<SUB>3</SUB>. SEM observation revealed that highly homogeneous thin film was formed on a substrate. In X-ray diffraction measurements, major peaks assigned to CuFe<SUB>2</SUB>O<SUB>4</SUB> was observed in heat-treated films. Quantitative analysis of elements in the deposited films indicated the deposition of CuFe<SUB>2</SUB>O<SUB>4</SUB>. The kinds of Cu-source did not affect on the deposition. Initial content of Cu<SUP>2+</SUP> could alter the Fe/Cu atomic ratio in deposited film.
- Chemistry letters
Chemistry letters 36(4), 518-519, 2007-04-05
The Chemical Society of Japan