Fabrication of Copper Ferrite Thin Films from Aqueous Solution by the Liquid-phase Deposition Method

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Liquid-phase deposition, LPD, method was used for the fabrication of copper ferrite (CuFe<SUB>2</SUB>O<SUB>4</SUB>) thin film from aqueous solution system of FeOOH–NH<SUB>4</SUB>·HF (aq.) and Cu source (Cu(NO<SUB>3</SUB>)<SUB>2</SUB> or CuCl<SUB>2</SUB>) with H<SUB>3</SUB>BO<SUB>3</SUB>. SEM observation revealed that highly homogeneous thin film was formed on a substrate. In X-ray diffraction measurements, major peaks assigned to CuFe<SUB>2</SUB>O<SUB>4</SUB> was observed in heat-treated films. Quantitative analysis of elements in the deposited films indicated the deposition of CuFe<SUB>2</SUB>O<SUB>4</SUB>. The kinds of Cu-source did not affect on the deposition. Initial content of Cu<SUP>2+</SUP> could alter the Fe/Cu atomic ratio in deposited film.

収録刊行物

  • Chemistry letters

    Chemistry letters 36(4), 518-519, 2007-04-05

    The Chemical Society of Japan

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    被引用文献8件

被引用文献:  1件中 1-1件 を表示

各種コード

  • NII論文ID(NAID)
    10018880915
  • NII書誌ID(NCID)
    AA00603318
  • 本文言語コード
    ENG
  • 資料種別
    SHO
  • ISSN
    03667022
  • データ提供元
    CJP書誌  CJP引用  J-STAGE 
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