High-Density Multi-Layer Thin-Substrate (MLTS) Technology for High-Performance LSI packages

• MATSUI Koji

  NEC Corporation

• BABA Kazuhiro

  NEC Corporation

• SHIMOTO Tadanori

  NEC Corporation

• SAKAI Jun

  NEC Corporation

• INOUE Hirobumi

  NEC Corporation

Bibliographic Information

Other Title

• 高速LSIパッケージ用薄型微細配線基板技術MLTS

Journal

• 電気学会研究会資料. ECT, 電子回路研究会

  電気学会研究会資料. ECT, 電子回路研究会 2003 (107), 17-22, 2003-12-16

Keywords

• flip chip
• BGA
• high pin count
• high density
• multi layer
• packaging substrate

Details

• CRID: 1571980075278919040
• NII Article ID: 10018969273
• NII Book ID: AN10441815
• Text Lang: ja
• Data Source:
  • CiNii Articles