A Trend of Packaging Technology of High-speed Circuit : An activity report of IEE of Japan research society on packaging technology of high-speed circuit

• OKIMURA Hiroshi

  the IEE of Japan research society on packaging technology of high-speed circuit

Bibliographic Information

Other Title

• 「高速回路実装技術調査専門委員会」活動報告 : 高速回路実装技術の現状と展望

Journal

• 電気学会研究会資料. ECT, 電子回路研究会

  電気学会研究会資料. ECT, 電子回路研究会 2001 (10), 33-38, 2001-01-25

Keywords

• packaging technology
• micro-soldering
• LSI
• build-up interconnecting board
• lead-free soldering

Details

• CRID: 1573950400120293120
• NII Article ID: 10018971442
• NII Book ID: AN10441815
• Text Lang: ja
• Data Source:
  • CiNii Articles