Dynamic and Static Restoration Behaviors of Pure Lead and Tin in the Ambient Temperature Range

• Hotta Satoshi

  Department of Materials Processing, Graduate School of Engineering, Tohoku University

• Matsumoto Keigo

  Department of Materials Processing, Graduate School of Engineering, Tohoku University

• Murakami Taichi

  Department of Materials Processing, Graduate School of Engineering, Tohoku University

• Narushima Takayuki

  Department of Materials Processing, Graduate School of Engineering, Tohoku University

• Ouchi Chiaki

  Department of Materials Processing, Graduate School of Engineering, Tohoku University

抄録

Dynamic and static restoration behaviors of pure lead and tin were investigated by compression tests, and the deformation temperature and strain rate were varied in the range from 223 to 348 K and from 2×10⁻³ to 1 s⁻¹, respectively. Lead and tin used had two purity levels of 99.999% (5N) and 99.9% (3N), and 5N and 4N, respectively. The hot working simulator was reformed so as to enable compression tests at low temperatures ranged from 223 to 273 K. S-S curves observed in lead and tin were those in dynamic recrystallization and dynamic recovery types of metals, respectively, of which activation energies were 92 to 119 kJ/mol in lead and 49 to 52 kJ/mol in tin. Steady state flow stress in lead with 5N purity was lower than that of tin with 5N purity. A reduction of purity level from 5N to 3N in lead significantly increased flow stress, but difference in purity level of 5N and 4N in tin exerted tiny influence on flow stress at strain rate below 1×10⁻¹ s⁻¹. Static recrystallization in lead with 5N purity completed in the holding time of less than 600 s even at 273 K, while tin with the same purity showed a slightly retarded recrystallization progress. A reduction of purity level in both metals extended the time period for completion of recrystallization by more than 2 orders.

収録刊行物

• MATERIALS TRANSACTIONS

  MATERIALS TRANSACTIONS 48 (10), 2665-2673, 2007

  公益社団法人 日本金属学会

キーワード

• pure lead
• pure tin
• lead plug
• seismic energy absorption
• dynamic recrystallization
• static recrystallization
• softening ratio

詳細情報

• CRID: 1390282679226425472
• NII論文ID: 10019956161
• NII論文ID: 120006846716
• NII論文ID: 130004453370
• NII書誌ID: AA1151294X
• DOI: 10.2320/matertrans.mra2007078
• ISSN: 13475320
• ISSN: 13459678
• HANDLE: 10097/00127750
• NDL書誌ID: 8931584
• Web Site: https://tohoku.repo.nii.ac.jp/records/130357
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I8931584
• Web Site: https://www.jstage.jst.go.jp/article/matertrans/48/10/48_MRA2007078/_pdf
• 本文言語コード: en
• データソース種別:
  • JaLC
  • IRDB
  • NDL
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可