Thermal-Safe Test Access Mechanism and Wrapper Cooptimization for System-on-Chip

Journal

Proc. of the 16th IEEE Asian Test Symposium (ATS'07), Oct. 2007  

Proc. of the 16th IEEE Asian Test Symposium (ATS'07), Oct. 2007, 2007 

Cited by:  1

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Codes

  • NII Article ID (NAID) :
    10020079565
  • Article Type :
    Proceedings
  • Databases :
    CJPref 

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