NF<sub>3</sub>ガス系プラズマRIEを用いたLiNbO<sub>3</sub>単結晶のマスク非使用による微細表面加工

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  • Fine Surface Processing of LiNbO<sub>3</sub> Single Crystal by Mask-less Etching Using NF<sub>3</sub> System Gas Plasma RIE
  • NF3ガス系プラズマRIEを用いたLiNbO3単結晶のマスク非使用による微細表面加工
  • NF3 ガスケイ プラズマ RIE オ モチイタ LiNbO3 タンケッショウ ノ マスク ヒシヨウ ニ ヨル ビサイ ヒョウメン カコウ

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Possibility of the deep etching using plasma reactive ion etching (RIE) without an etching-mask (mask-less) for -Z and +Z parts formed on the same surface by partially polarization reversing LiNbO3 single crystal polarized in the direction of c-axis is investigated. NF3/H2 mixture gas was used. The etching rates, depths and the profiles of etched surfaces were evaluated by atomic force microscopy (AFM) and optical microscope. The etching rate for -Z surface was larger than that for +Z surface. The extension of +Z domain by the partially polarization-reversing was observed. Applying the high voltage quickly for the partially polarization-reversing, the area of +Z domain was extended compared with applying voltage slowly. Apparent step at the boundary between -Z and +Z parts formed on the same surface was observed. Using NF3/H2 mixture gas, segments are removed efficiently. It is concluded that RIE etching using NF3/H2 mixture gas is suitable for processing of LiNbO3 crystal surface without a etching-mask compared with CF4/H2 mixture gas.

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