FDTD電磁界・半導体デバイス統合解析によるミリ波表面波モード線路増幅モジュールの実動作解析 Analysis of Millimeterwave Amplifier Module with Surface Wave Mode Transmission Line by FDTD Electromagnetic-Semiconductor Device Co-Simulation
Direct analysis for a millimeterwave amplifier module has been demonstrated by using FDTD electromagnetic and semiconductor device co-simulation technique. The millimeterwave amplifier module consists of an HFET and planar dielectric transmission lines (PDTL) at 60-GHz region. The PDTL with a surface wave transmission mode has a low-loss transmission characteristic at millimeterwave region using a low-loss ceramic substrate. However, the transmission wave on the PDTL tends to be scattered by irregular structures and impedance mismatching. Furthermore, it is predicted that reflected scattered waves at edges of the substrate interfere with incident and transmission waves on the PDTL. Using the co-simulation technique, influence of the scattering waves was investigated in detail for the amplifier module.
- 電気学会論文誌. C, 電子・情報・システム部門誌 = The transactions of the Institute of Electrical Engineers of Japan. C, A publication of Electronics, Information and System Society
電気学会論文誌. C, 電子・情報・システム部門誌 = The transactions of the Institute of Electrical Engineers of Japan. C, A publication of Electronics, Information and System Society 128(6), 865-871, 2008-06-01
The Institute of Electrical Engineers of Japan