Debris-Free Laser-Assisted Low-Stress Dicing for Multi-Layered MEMS-Separation Method of Glass Layer-

• Izawa Yusaku

  Institute of Laser Engineering, Osaka University

• Tsurumi Yosuke

  Institute of Laser Engineering, Osaka University

• Tanaka Shuji

  Department of Nanomechanics, Tohoku University

• Kikuchi Hideyuki

  Department of Nanomechanics, Tohoku University

• Sueda Keichi

  Institute of Laser Engineering, Osaka University

• Nakata Yoshiki

  Institute of Laser Engineering, Osaka University

• Esashi Masayoshi

  Department of Nanomechanics, Tohoku University

• Miyanaga Noriaki

  Institute of Laser Engineering, Osaka University

• Fujita Masayuki

  Institute for Laser Technology

書誌事項

タイトル別名

• —Separation Method of Glass Layer—

抄録

We have investigated the novel debris-free in-air laser dicing technology for glass. The target wafer was a soda lime glass and a Pyrex glass with the thickness of 1 mm. Our technology combines two processes, which was a dicing guide fabrication and a wafer separation process. First process was the internal transformation using a fundamental wavelength of a Ti:Sapphire laser or a Nd:YAG laser. The pulse width of each laser was 100 fs and 10 ns. The threshold energy for the internal transformation (NA-0.7 focusing) was 3 μJ and 65 μJ, respectively. The second process was a thermally-induced crack propagation using CO₂ laser or a mechanical bending separation by pressing a blade. The internal transformation fabricated in first process worked sufficiently as the guide of separation, the dicing line completely followed the internal transformation. The diced cross-section was sharp and free from chipping. In addition, neither debris nor damages were found on the surface after laser dicing.

収録刊行物

• 電気学会論文誌Ｅ（センサ・マイクロマシン部門誌）

  電気学会論文誌Ｅ（センサ・マイクロマシン部門誌） 128 (3), 91-96, 2008

  一般社団法人 電気学会

キーワード

• debris-free laser dicing
• internal transformation
• noncontact wafer separation
• thermal stress
• glass
• MEMS

詳細情報

• CRID: 1390001204459961472
• NII論文ID: 10021135056
• NII書誌ID: AN1052634X
• DOI: 10.1541/ieejsmas.128.91
• ISSN: 13475525
• ISSN: 13418939
• NDL書誌ID: 9400705
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I9400705
• Web Site: http://www.jstage.jst.go.jp/article/ieejsmas/128/3/128_3_91/_pdf
• 本文言語コード: en
• データソース種別:
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