Compact Triangulation Sensor Realized by Bending Si Wafer with Optical Elements at Metal Hinges
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A triangulation distance sensor is constructed bending the wafer with metal hinges. On the Si wafer, elements are pre-aligned at the planer condition using the photolithography. The position sensitive detector (PSD), mirror, and alignment pit for a ball lens are prepared. 3-sensor array is integrated in 20×17×10 mm<sup>3</sup> size. Compared with our previous study using polymer, the metal hinge stabilizes the long-term performance and the process. Optical elements including LD chip are all included on the wafer. The demonstrated measurement range is 18-40 mm.
- The Journal of the Institute of Electrical Engineers of Japan
The Journal of the Institute of Electrical Engineers of Japan 128(6), 271-276, 2008-06-01
The Institute of Electrical Engineers of Japan