Effects of Ultrasound on Morphology of Copper Electrodeposited on Titanium in Aqueous and Organic Solutions

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The copper films were electrodeposited from aqueous and organic solutions in the presence and in the absence of ultrasound. The internal stress and texture in copper films were studied using the X-ray diffraction (XRD). The results showed that the internal stress and texture of the copper films were reduced on the effect of ultrasound. The surface morphology of copper grains was investigated using scanning electron microscopy (SEM). The results showed that the porous structure was formed on the surface of copper grains deposited in organic solution under ultrasonic radiation.

収録刊行物

  • Materials transactions  

    Materials transactions 49(2), 275-277, 2008-02-01 

    The Japan Institute of Metals and Materials

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各種コード

  • NII論文ID(NAID)
    10021144078
  • NII書誌ID(NCID)
    AA1151294X
  • 本文言語コード
    ENG
  • 資料種別
    ART
  • ISSN
    13459678
  • NDL 記事登録ID
    9354319
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z53-J286
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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