Synthesis of the Combination Solder of 80Au-20Sn/42Sn-58Bi and Thermodynamic Interpretation of the Microstructural Evolution

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A Pb-free combination solder structure was successfully attained from a high-melting 80Au-20Sn solder alloy completely wrapped in a low-melting 42Sn-58Bi solder paste (the numbers of which are all in mass% unless specified). The phases of (Au,Ni)<SUB>3</SUB>Sn<SUB>4</SUB> and AuSn<SUB>4</SUB> were observed at the interface between Sn-Bi solder and Cu/Ni/Au UBM, whereas the (Au,Ni)<SUB>3</SUB>Sn<SUB>2</SUB> phase was observed at the interface between Au-Sn solder and Cu/Ni/Au UBM. The interfacial reaction between the Au-Sn solder and the Sn-Bi solder resulted in the formation of AuSn<SUB>2</SUB> on the side of the Sn-Bi solder and AuSn on the side of the Au-Sn solder. All of these interfacial reactions were explained with relevant equilibrium phase diagrams. Moreover, we found that there is a limit in the optimum solder volume for a well-defined combination solder structure that can be applied to organic substrates with an increased remelting temperature.

収録刊行物

  • Materials transactions  

    Materials transactions 49(2), 376-381, 2008-02-01 

    The Japan Institute of Metals and Materials

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各種コード

  • NII論文ID(NAID)
    10021144392
  • NII書誌ID(NCID)
    AA1151294X
  • 本文言語コード
    ENG
  • 資料種別
    ART
  • ISSN
    13459678
  • NDL 記事登録ID
    9354781
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z53-J286
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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