Effects of Phosphorus on Microstructure and Fluidity of Sn-0.7Cu-0.05Ni Lead-Free Solder
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- Nogita K.
- Materials Engineering, The University of Queensland
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- Gourlay C. M.
- Materials Engineering, The University of Queensland
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- Read J.
- Materials Engineering, The University of Queensland
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- Nishimura T.
- Nihon Superior Co., Ltd, NS Bldg.
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- Suenaga S.
- Nihon Superior Co., Ltd, NS Bldg.
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- Dahle A. K.
- Materials Engineering, The University of Queensland
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Phosphorus is often added to wave-solder baths as an anti-oxidation agent. Despite this practice, there is little information on how phosphorus influences the solidification and flow properties of new lead-free solders such as Sn-0.7Cu-0.05Ni. This paper investigates the effects of phosphorus content on microstructure and maximum fluidity length in Sn-0.7Cu-0.05Ni-xP alloys containing 0–0.08 mass% phosphorous. Ppm levels of phosphorous are found to cause Sn-xP, Ni-xP-(Sn) and Cu-xP-(Sn) intermetallic compounds to form in the liquid solder. The IMCs are less dense than liquid Sn and float towards the surface of the melt driven by buoyancy. It is shown that P-free Sn-0.7Cu-0.05Ni solidifies with a near-eutectic microstructure whereas, when P is added to this alloy, a significant volume fraction of primary Sn dendrites form once the P content exceeds ∼0.01 mass% P. It is further shown that P additions decrease the ability of Sn-0.7Cu-0.05Ni to flow as it solidifies.
収録刊行物
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- MATERIALS TRANSACTIONS
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MATERIALS TRANSACTIONS 49 (3), 443-448, 2008
公益社団法人 日本金属学会
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詳細情報 詳細情報について
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- CRID
- 1390282679226576896
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- NII論文ID
- 10021144605
- 130004453910
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- NII書誌ID
- AA1151294X
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- ISSN
- 13475320
- 13459678
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- NDL書誌ID
- 9412882
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDL
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