Equal Channel Angular Extrued Bi_<0.5>Sb_<1.5>Te_3 Thermoelectric Compound

この論文にアクセスする

この論文をさがす

著者

抄録

The effects of equal channel angular extrusion (ECAE) process parameters on microstructure and thermoelectric properties of the p-type Bi<SUB>0.5</SUB>Sb<SUB>1.5</SUB>Te<SUB>3</SUB> compound have been investigated. ECAE was carried out under various temperatures (653 K, 693 K, 733 K) and ram speeds (0.5 mm/s, 1 mm/s, 2 mm/s). Fraction of recrystallized grains and grain size was found to be increase with lower ram speed and higher deformation temperature. As a result, Seebeck coefficient increased, and electrical resistivity and thermal conductivity decreased. The decrease in thermal conductivity was attributed to the decrease of lattice thermal conductivity (κ<SUB>ph</SUB>) which is independent of electrical properties. Maximum figure-of-merit (2.87×10<SUP>−3</SUP> K<SUP>−1</SUP>) was achieved in as-ECAE'ed specimen at 733 K and at ram speed of 0.5 mm/s. This value was found to be 6% higher than that of as-sintered specimen.

収録刊行物

  • Materials transactions  

    Materials transactions 49(4), 889-891, 2008-04-01 

    The Japan Institute of Metals and Materials

参考文献:  15件

参考文献を見るにはログインが必要です。ユーザIDをお持ちでない方は新規登録してください。

被引用文献:  1件

被引用文献を見るにはログインが必要です。ユーザIDをお持ちでない方は新規登録してください。

各種コード

  • NII論文ID(NAID)
    10021146186
  • NII書誌ID(NCID)
    AA1151294X
  • 本文言語コード
    ENG
  • 資料種別
    SHO
  • ISSN
    13459678
  • NDL 記事登録ID
    8699336
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z53-J286
  • データ提供元
    CJP書誌  CJP引用  NDL  J-STAGE 
ページトップへ