Characteristics of Zn-Al-Cu Alloys for High Temperature Solder Application
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- Kim Seong-Jun
- Department of Adaptive Machine Systems, Graduate School of Engineering, Osaka University
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- Kim Keun-Soo
- Institute of Scientific and Industrial Research, Osaka University
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- Kim Sun-Sik
- Institute of Scientific and Industrial Research, Osaka University
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- Kang Chung-Yun
- Department of Materials Engineering, Pusan National University
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- Suganuma Katsuaki
- Institute of Scientific and Industrial Research, Osaka University
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Melting range, microstructure, mechanical properties and spreadabililty of Zn-(4∼6 mass%)Al-(1∼6 mass%)Cu alloys were investigated. Liquidus temperature was targeted between 655 and 675 K, and solidus temperature was targeted to 645 K. The liquidus temperature of the Zn-Al-Cu solders increased with Cu contents, but it decreased with Al contents. Microstructures of the Zn-Al-Cu solders consisted of primary ε-phase (CuZn4), η-phase (Zn matrix), α-η eutectic phase (Zn-Al eutectic) and ε-η eutectic phase (Zn-Cu eutectic), irrespective of the Al and Cu contents. Increasing the Al and Cu contents, hardness and tensile strength increased, but elongation decreased. The Al content played an important role in improving the spread ratio, the Cu content had no significant influence on the spread ratio.
収録刊行物
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- MATERIALS TRANSACTIONS
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MATERIALS TRANSACTIONS 49 (7), 1531-1536, 2008
公益社団法人 日本金属学会
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詳細情報 詳細情報について
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- CRID
- 1390001204249159040
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- NII論文ID
- 10021148125
- 130004454033
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- NII書誌ID
- AA1151294X
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- COI
- 1:CAS:528:DC%2BD1cXhtV2isr7E
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- ISSN
- 13475320
- 13459678
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- NDL書誌ID
- 9555553
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可