TaAl-N Thin Film Prepared by Radio Frequency and Direct Current Reactive Sputtering
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- OKANO Yukiko
- Okano Works, Ltd.
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- TAJIRI Shuichi
- Okano Works, Ltd.
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- AOZONO Takashi
- Okano Works, Ltd.
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- OKAMOTO Akio
- Technology Research Institute of Osaka Prefecture
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- OGAWA Soichi
- Ogawa Creation Research Laboratory
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- MIMA Hiroshi
- Osaka City University
Bibliographic Information
- Other Title
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- 高周波電力を重畳した直流反応性スパッタ法によるTaAl‐N膜の作製
- 高周波電力を重畳した直流反応性スパッタ法によるTaAl-N薄膜の作製
- コウシュウハ デンリョク オ チョウジョウシタ チョクリュウ ハンノウセイ スパッタホウ ニ ヨル TaAl N ハクマク ノ サクセイ
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Abstract
The electrical characteristics of TaAl-N thin films prepared by radio frequency (RF) superimposed and direct current (DC) reactive sputtering method was investigated. The properties of TaAl-N thin films were strongly influenced by the sputtering method. In the condition of Rn=30% [Rn=F(N2)/(F(N2)+F(Ar))], total pressure 0.3 Pa, the resistivity (at RT) was 3.1 Ωcm and the TCR (at 150°C) (the temperature coefficient of the resistivity) was (-) 13000 ppm/°C. The stresses of TaAl-N thin films were relieved.<br>
Journal
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- Journal of the Vacuum Society of Japan
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Journal of the Vacuum Society of Japan 51 (3), 208-210, 2008
The Vacuum Society of Japan
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Details 詳細情報について
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- CRID
- 1390001205295559808
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- NII Article ID
- 10021157069
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- NII Book ID
- AA12298652
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- ISSN
- 18824749
- 18822398
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- NDL BIB ID
- 9471593
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed