非平衡スパッタリング法によるTi-Ni形状記憶合金薄膜の作製とその通電加熱に伴う形状記憶挙動 Fabrication of Ti-Ni Shape Memory Alloy Films by Unbalanced Magnetron Sputtering and Their Joule Heat Induced Shape Memory Behavior

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  We have optimized the deposition conditions for fabricating Ti-Ni shape memory films by dc unbalanced magnetron sputtering using Taguchi method. The deposited films were annealed at 600°C for 60 min for crystallization and memorization into a flat shape after dissolving the Cu substrates. These films were subjected to DSC measurements and thermal cycling tests under a constant stress. The Joule heat induced shape memory behavior was also characterized by a specially designed tensile testing machine.<br>   The transformation temperature of Ni-rich films was found to be lower than RT. On the other hand, those of Ti-47∼49.4 at%Ni films were higher than RT, which means they can be expected to show the shape memory effect at RT. The Ti-47∼49.4 at%Ni films showed a perfect shape recovery under a constant stress by Joule heat of less than 0.1 J.<br>

収録刊行物

  • 真空  

    真空 51(5), 312-315, 2008-05-20 

    The Vacuum Society of Japan

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各種コード

  • NII論文ID(NAID)
    10021157442
  • NII書誌ID(NCID)
    AN00119871
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    18822398
  • NDL 記事登録ID
    9541012
  • NDL 雑誌分類
    ZN15(科学技術--機械工学・工業--流体機械)
  • NDL 請求記号
    Z16-474
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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